Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Package / Case |
256-LBGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
SmartFusion® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
TIN LEAD/TIN LEAD SILVER |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
225 |
Supply Voltage |
1.5V |
Terminal Pitch |
1mm |
Frequency |
80MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
A2F200 |
Number of Outputs |
66 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.5V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Max Supply Voltage |
1.575V |
Min Supply Voltage |
1.425V |
Operating Supply Current |
2mA |
Number of I/O |
MCU - 25, FPGA - 66 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Number of Gates |
200000 |
Number of Logic Blocks (LABs) |
8 |
Primary Attributes |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Flash Size |
256KB |
Height Seated (Max) |
1.7mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion? series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.It is really beneficial to have system on a chip since there are 256 terminations in total.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 66 outputs available on this SoC.This flash has a size of 256KB.You can get system on chips with similar specs and purposes by searching A2F200.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is available in 256-pin form.A maximum supply voltage of 1.575V is specified for the SoC security.A minimum of 1.425V are supplied to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FG256 System On Chip (SoC) applications.
- Flow Sensors
- Medical Pressure
- Cyber security for critical applications in the aerospace
- High-end PLC
- Transmitters
- Video Imaging
- Digital Signal Processing
- External USB hard disk/SSD
- Cyberphysical system-on-chip
- Smartphones