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A2F200M3F-FGG256

0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F200M3F-FGG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 871
  • Description: 0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2011
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers 4608
Flash Size 256KB
Radiation Hardening No
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion? series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.It is packaged in a state-of-the-art Tray package.MCU - 25, FPGA - 66 I/Os are included in this SoC part.There is a flash of 256KB.Searching A2F200 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 80MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.This is the 256-pin version of the computer SoC.It is just enough to start the SoC computing at 0°C.There is a design maximum operating temperature of 85°C for this SoC system on chip.It has a maximum supply voltage of 1.575V rated for it.The SoC security is powered at least by 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FGG256 System On Chip (SoC) applications.

  • Mouse
  • Optical drive
  • Cyberphysical system-on-chip
  • Defense
  • CNC control
  • Digital Media
  • Efficient hardware for inference of neural networks
  • Multiprocessor system-on-chips (MPSoCs)
  • Special Issue Editors
  • ARM

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