Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-BGA |
Surface Mount |
YES |
Number of Pins |
484 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2011 |
Series |
SmartFusion® |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.5V |
Terminal Pitch |
1mm |
Frequency |
80MHz |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
A2F200 |
Number of Outputs |
94 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.5V |
Power Supplies |
1.51.82.53.3V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Max Supply Voltage |
1.575V |
Min Supply Voltage |
1.425V |
Memory Size |
4.5kB |
Operating Supply Current |
7mA |
Number of I/O |
MCU - 41, FPGA - 94 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Data Rate |
400 kbps |
Architecture |
MCU, FPGA |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
2500 |
Core Architecture |
ARM |
Number of Gates |
200000 |
Primary Attributes |
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion? series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 41, FPGA - 94 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 484 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 94 outputs, which is convenient.This system on chip SoC requires 1.51.82.53.3V power supply at all.A 256KB flash can be seen on it.Search A2F200 for system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.This is the version with 484 pins.This power supply is rated with a maximum voltage of 1.575V.At least 1.425V power is delivered to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FGG484 System On Chip (SoC) applications.
- Automated sorting equipment
- Cyber security for critical applications in the aerospace
- Test and Measurement
- Mobile market
- Central alarm system
- Functional safety for critical applications in the aerospace
- Temperature
- Functional safety for critical applications in the industrial sectors
- AC drive control module
- System-on-chip (SoC)