Parameters |
Factory Lead Time |
1 Week |
Package / Case |
288-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion® |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
288 |
Terminal Finish |
TIN LEAD SILVER |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
235 |
Supply Voltage |
1.5V |
Terminal Pitch |
0.5mm |
Frequency |
100MHz |
Time@Peak Reflow Temperature-Max (s) |
20 |
Base Part Number |
A2F500M3G |
JESD-30 Code |
S-PBGA-B288 |
Number of Outputs |
78 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.575V |
Power Supplies |
1.51.82.53.3V |
Supply Voltage-Min (Vsup) |
1.425V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Number of I/O |
MCU - 31, FPGA - 78 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Number of Inputs |
78 |
Organization |
11520 CLBS, 500000 GATES |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Number of Equivalent Gates |
500000 |
Flash Size |
512KB |
Height Seated (Max) |
1.05mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.This system on a chip is packaged as 288-TFBGA, CSPBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.It comes in a state-of-the-art Tray package.MCU - 31, FPGA - 78 I/Os are included in this SoC part.It is recommended to use a 1.5V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.The system on a chip uses 288 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.It is possible to use this SoC chip with 78 outputs.A power supply of 1.51.82.53.3V is required.A SoC chip with 78 inputs is available to the user.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.The SoC meaning is based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1CS288I System On Chip (SoC) applications.
- Temperature
- Medical
- Efficient hardware for training of neural networks
- Remote control
- Test and Measurement
- Healthcare
- PC peripherals
- Industrial robot
- Automotive gateway
- Self-aware system-on-chip (SoC)