A2F500M3G-1FG484I
| Parameters | |
|---|---|
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Base Part Number | A2F500M3G |
| Number of Outputs | 128 |
| Operating Supply Voltage | 1.5V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Operating Supply Current | 1mA |
| Number of I/O | MCU - 41, FPGA - 128 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Gates | 500000 |
| Number of Logic Blocks (LABs) | 24 |
| Speed Grade | 1 |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Number of Registers | 11520 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Package / Case | 484-BGA |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.5V |
| Frequency | 100MHz |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the SmartFusion? series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 41, FPGA - 128 inputs and outputs.It is recommended to use a 1.5V power supply.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 484 terminations in total makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 128 outputs, which is convenient.There is a flash of 512KB.Search A2F500M3G for system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.In this SoC meaning, ARM serves as the core architecture.The computer SoC has a pin count of 484.It is rated with 1.575V maximum supply voltage.Power is provided to it at least to the extent that 1.425V is required.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FG484I System On Chip (SoC) applications.
- Defense
- Industrial automation devices
- Deep learning hardware
- PC peripherals
- Smartphones
- Functional safety for critical applications in the industrial sectors
- Communication interfaces ( I2C, SPI )
- External USB hard disk/SSD
- Avionics
- Microcontroller based SoC ( RISC-V, ARM)
