A2F500M3G-1FGG256I
| Parameters | |
|---|---|
| Number of I/O | MCU - 25, FPGA - 66 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Gates | 500000 |
| Number of Logic Blocks (LABs) | 24 |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Flash Size | 512KB |
| Height Seated (Max) | 1.7mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | SmartFusion® |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F500M3G |
| Number of Outputs | 66 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.575V |
| Power Supplies | 1.51.82.53.3V |
| Supply Voltage-Min (Vsup) | 1.425V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.An excessive voltage of 1.575V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.This SoC system on a chip can run on a power supply that is at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which is great for system on a chip.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There is the option to have 66 outputs on this SoC chip.There is 1.51.82.53.3V power supply requirement for this system on chip SoC.The flash is set to 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F500M3G.wireless SoCs operate at 100MHz.In this SoC meaning, ARM serves as the core architecture.This is the version with 256 pins.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG256I System On Chip (SoC) applications.
- Central alarm system
- USB hard disk enclosure
- Industrial AC-DC
- High-end PLC
- Microcontroller
- Functional safety for critical applications in the automotive
- Digital Media
- Servo drive control module
- Mouse
- Embedded systems
