A2F500M3G-1FGG484I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Package / Case | 484-BGA |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F500M3G |
| Number of Outputs | 128 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.5V |
| Power Supplies | 1.51.82.53.3V |
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Memory Size | 13.5kB |
| Operating Supply Current | 16.5mA |
| Number of I/O | MCU - 41, FPGA - 128 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Data Rate | 400 kbps |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 5500 |
| Core Architecture | ARM |
| Number of Gates | 500000 |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 484-BGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 128 outputs.You will need to provide 1.51.82.53.3V power supplies in order to run system on chip.It has a 512KB flash.A search for A2F500M3G will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.This power supply is rated with a maximum voltage of 1.575V.A minimum of 1.425V are supplied to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG484I System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- Functional safety for critical applications in the industrial sectors
- Apple smart watch
- ARM processors
- DC-input BLDC motor drive
- Personal Computers
- PC peripherals
- ARM support modules
- POS Terminals
- Digital Signal Processing
