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A2F500M3G-1FGG484M

-55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F500M3G-1FGG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 194
  • Description: -55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O(Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 484-BGA
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Frequency 100MHz
Base Part Number A2F500M3G
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series SmartFusion?.The average operating temps for this SoC meaning should be -55°C~125°C TJ.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.This flash has a size of 512KB.By searching A2F500M3G, you can find system on chips with similar specs and purposes.There is 100MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG484M System On Chip (SoC) applications.

  • Industrial robot
  • POS Terminals
  • Medical Pressure
  • Communication network-on-Chip (cNoC)
  • CNC control
  • Automotive
  • Deep learning hardware
  • Networked Media Encode/Decode
  • Automotive gateway
  • Mobile computing

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