Parameters |
Factory Lead Time |
1 Week |
Package / Case |
288-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2003 |
Series |
SmartFusion® |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
288 |
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
235 |
Supply Voltage |
1.5V |
Terminal Pitch |
0.5mm |
Frequency |
80MHz |
Time@Peak Reflow Temperature-Max (s) |
20 |
Base Part Number |
A2F500M3G |
JESD-30 Code |
S-PBGA-B288 |
Number of Outputs |
78 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.575V |
Power Supplies |
1.51.82.53.3V |
Supply Voltage-Min (Vsup) |
1.425V |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Number of I/O |
MCU - 31, FPGA - 78 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Number of Inputs |
78 |
Organization |
11520 CLBS, 500000 GATES |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Number of Equivalent Gates |
500000 |
Flash Size |
512KB |
Height Seated (Max) |
1.05mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 288-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion? series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 31, FPGA - 78 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.The SoCs wireless cannot operate at a voltage greater than 1.575V because it is considered unsafe for the application.There is a possibility that it can be powered by a power supply of at least 1.425V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.system on a chip benefits from 288 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 78 outputs.In order to operate system on chip, you will need 1.51.82.53.3V power supplies.The SoC chip is equipped with 78 inputs.As for its flash size, it is 512KB.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-CS288I System On Chip (SoC) applications.
- Mouse
- Vending machines
- Functional safety for critical applications in the automotive
- Central alarm system
- Sports
- Industrial transport
- System-on-chip (SoC)
- Level
- POS Terminals
- Body control module