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A2F500M3G-FG484M

484 Terminations-55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F500M3G-FG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 552
  • Description: 484 Terminations-55°C~125°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O1.5V (Kg)

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Parameters
Factory Lead Time 1 Week
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number A2F500M3G
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion? series.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of MCU - 41, FPGA - 128 I/Os.Ideally, a power supply with a voltage of 1.5V should be used.In the SoCs wireless, voltages above 1.575V are considered unsafe.If it has at least a 1.425V volt power supply, it can work fine.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 484 terminations.A 512KB flash can be seen on it.A2F500M3G can help you find system on chips with similar specs and purposes.A frequency of 80MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FG484M System On Chip (SoC) applications.

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