banner_page

A2F500M3G-FGG256

0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F500M3G-FGG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 565
  • Description: 0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

Details

Tags

Parameters
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 13.5kB
Operating Supply Current 16.5mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 5500
Core Architecture ARM
Number of Gates 500000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status RoHS Compliant
Lead Free Lead Free
Factory Lead Time 1 Week
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
Part Status Active

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops together.Tray package houses this SoC system on a chip.MCU - 25, FPGA - 66 I/Os in total are included in this SoC part.There is a flash of 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.The SoC meaning is based on the core architecture of ARM.In this computer SoC, there are 256 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.There is a design maximum operating temperature 85°C specified for this SoC system on chip.According to its specification, the maximum voltage SoC can handle is 1.575V.As long as it receives at least 1.425V of power, then it is working.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FGG256 System On Chip (SoC) applications.

  • ARM processors
  • Fitness
  • DC-input BLDC motor drive
  • Automated sorting equipment
  • Automotive
  • Mobile computing
  • Transmitters
  • Microcontroller
  • Medical Pressure
  • Efficient hardware for training of neural networks

Write a review

Note: HTML is not translated!
    Bad           Good