Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-BGA |
Operating Temperature |
-55°C~125°C TJ |
Packaging |
Tray |
Series |
SmartFusion® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Frequency |
80MHz |
Base Part Number |
A2F500M3G |
Interface |
EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Number of I/O |
MCU - 41, FPGA - 128 |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Flash Size |
512KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion? series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.MCU - 41, FPGA - 128 I/Os are available in this SoC part.This flash has a size of 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 80MHz.Core architecture of ARM underpins the SoC meaning.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
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A2F500M3G-FGG484M System On Chip (SoC) applications.
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