Parameters | |
---|---|
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-TSSOP, SC-88, SOT-363 |
Number of Pins | 6 |
Packaging | Bulk |
Published | 2004 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | HIGH RELIABILITY |
Subcategory | RF/Microwave Amplifiers |
Max Power Dissipation | 300mW |
Technology | BIPOLAR |
Voltage - Supply | 2.7V~3.5V |
Number of Functions | 1 |
Construction | COMPONENT |
Frequency | 0Hz~3.5GHz |
Power Supplies | 3V |
Test Frequency | 2GHz |
Operating Supply Current | 16mA |
Nominal Supply Current | 14mA |
Power Dissipation | 300mW |
Drain to Source Voltage (Vdss) | 6V |
Continuous Drain Current (ID) | 14mA |
Gain | 20dB ~ 21.5dB |
RF/Microwave Device Type | WIDE BAND LOW POWER |
VSWR-Max | 1.5 |
RF Type | Cellular, DBS, ISM, LAN, PCS, TVRO |
Characteristic Impedance | 50Ohm |
Noise Figure | 3.8dB ~ 4.8dB |
P1dB | 2.2dBm |
Number of Amplifiers | 1 |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |