Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 324-BBGA |
Surface Mount | YES |
Packaging | Tray |
Series | AD6635 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 324 |
Terminal Finish | TIN LEAD |
Technology | CMOS |
Voltage - Supply | 3V~3.6V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Number of Functions | 1 |
Supply Voltage | 2.5V |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 324 |
JESD-30 Code | S-PBGA-B324 |
Qualification Status | COMMERCIAL |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Temperature Grade | INDUSTRIAL |
Current - Supply | 880mA |
Telecom IC Type | BASEBAND CIRCUIT |
RF Type | Cellular, CDMA2000, EDGE, GPRS, GSM |
Number of Mixers | 1 |
Height Seated (Max) | 3.5mm |
RoHS Status | Non-RoHS Compliant |