AD6636BBCZ
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | PRODUCTION (Last Updated: 6 days ago) |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA, CSPBGA |
| Number of Pins | 256 |
| Packaging | Tray |
| Series | AD6636 |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 975mW |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 256 |
| Operating Supply Voltage | 1.8V |
| Temperature Grade | INDUSTRIAL |
| Operating Supply Current | 450mA |
| Resolution | 2 B |
| Settling Time | 3.37 μs |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| RF Type | Cellular, CDMA2000, EDGE, GPRS, GSM |
| Secondary Attributes | Down Converter |
| Number of Mixers | 1 |
| Height | 1.31mm |
| Length | 17.2mm |
| Width | 17.2mm |
| Thickness | 1.71mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet
