Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 2 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 64-WFQFN Exposed Pad, CSP |
Number of Pins | 64 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 64 |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Terminal Position | QUAD |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.25V |
Terminal Pitch | 0.5mm |
Frequency | 385MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | AD6674 |
Function | IF Receiver |
Temperature Grade | INDUSTRIAL |
Power Dissipation | 555mW |
Max Output Voltage | 20V |
Min Input Voltage | 8V |
Logic Function | Receiver |
Slew Rate | 10 V/μs |
Max Input Voltage | 11V |
Resolution | 1.5 B |
Sampling Rate | 500 ksps |
Min Output Voltage | 5V |
Settling Time | 2 μs |
Telecom IC Type | TELECOM CIRCUIT |
RF Type | Cellular |
Height Seated (Max) | 0.8mm |
Length | 9mm |
Width | 9mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |