Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | 24-WFQFN Exposed Pad, CSP |
Number of Pins | 24 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 24 |
ECCN Code | 5A991.B |
HTS Code | 8542.39.00.01 |
Subcategory | Other Telecom ICs |
Max Power Dissipation | 825mW |
Technology | BIPOLAR |
Voltage - Supply | 4.75V~5.25V |
Terminal Position | QUAD |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 5V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | AD8340 |
Function | Vector, Modulator |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Operating Supply Voltage | 5V |
Power Supplies | 5V |
Temperature Grade | INDUSTRIAL |
Test Frequency | 880MHz |
Operating Supply Current | 130mA |
Nominal Supply Current | 130mA |
Max Supply Current | 150A |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
P1dB | 11dBm |
RF Frequency | 700MHz~1GHz |
LO Frequency | 700MHz~1GHz |
Noise Floor | -149dBm/Hz |
Height Seated (Max) | 1mm |
Length | 3.75mm |
Width | 4mm |
Thickness | 850μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |