Parameters | |
---|---|
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 24-VFQFN Exposed Pad, CSP |
Number of Pins | 24 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 24 |
ECCN Code | EAR99 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Subcategory | Other Analog ICs |
Max Power Dissipation | 1.1W |
Technology | BIPOLAR |
Voltage - Supply | 4.75V~5.25V |
Terminal Position | QUAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 5V |
Terminal Pitch | 0.5mm |
Frequency | 10MHz~3GHz |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | ADL5330 |
Pin Count | 24 |
Operating Supply Voltage | 5.25V |
Power Supplies | 5V |
Temperature Grade | INDUSTRIAL |
Supply Voltage-Min (Vsup) | 4.75V |
Number of Channels | 1 |
Test Frequency | 2.7GHz |
Analog IC - Other Type | ANALOG CIRCUIT |
Operating Supply Current | 215mA |
Nominal Supply Current | 215mA |
Power Dissipation | 1.1W |
Gain | 10dB |
-3db Bandwidth | 3 GHz |
RF Type | Cellular, CDMA2000, W-CDMA, GSM |
Noise Figure | 14.7 dB |
P1dB | 1.2dBm |
Length | 3.75mm |
Width | 4mm |
Thickness | 850μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |