Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 3 months ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 20-WQFN Exposed Pad, CSP |
Number of Pins | 20 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 20 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Max Power Dissipation | 500mW |
Technology | BICMOS |
Voltage - Supply | 3.3V~5V |
Terminal Position | QUAD |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 5V |
Terminal Pitch | 0.65mm |
Frequency | 2.3GHz~2.9GHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | ADL5363 |
Pin Count | 20 |
Operating Supply Voltage | 5V |
Temperature Grade | INDUSTRIAL |
Operating Supply Current | 100mA |
Nominal Supply Current | 100mA |
Power Dissipation | 500mW |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular |
Noise Figure | 7.6dB |
P1dB | 20 dBm |
Number of Mixers | 1 |
Power Gain | -7.8dB |
Height Seated (Max) | 0.9mm |
Length | 5mm |
Width | 5mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |