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ADM1030ARQZ

16-SSOP (0.154, 3.90mm Width) Thermal Management


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-ADM1030ARQZ
  • Package: 16-SSOP (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 966
  • Description: 16-SSOP (0.154, 3.90mm Width) Thermal Management (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 16-SSOP (0.154, 3.90mm Width)
Surface Mount YES
Operating Temperature 0°C~100°C
Packaging Tube
JESD-609 Code e3
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish MATTE TIN
Voltage - Supply 3V~5.5V
Function Fan Control, Temp Monitor
Body Length or Diameter 4.9mm
Body Breadth 3.91 mm
Output Type SMBus
Termination Type SOLDER
Number of Bits 8
Accuracy ±1°C, ±1°C(Max)
Topology ADC, Comparator, Multiplexer, Register Bank
Sensor Type Internal and External
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Housing PLASTIC
Output Interface Type 2-WIRE INTERFACE
Output Alarm Yes
Sensing Temperature 0°C~100°C External Sensor
Body Height 1.44mm
RoHS Status ROHS3 Compliant

ADM1030ARQZ Overview


Designed to meet Tube's material specifications.Its output type is SMBus.Its low package cost makes it familiar to those in the electronics industry.As Fan Control, Temp Monitor, it is capable of acting.The device will be mounted by pressing Surface Mount.Internal and External-type is incorporated in it.For reliable operation, a temperature of 0°C~100°C should be maintained.By providing 3V~5.5V Supply Voltage, it will operate normally.There is a way to measure 0°C~100°C External Sensor's sensing temperature.8 bits can be used to store information.Thermal management uses SOLDER as Thermal managements termination Type to minimie signal reflections, and power losses. Digital signals can be converted into analog signals using 2-WIRE INTERFACE.

ADM1030ARQZ Features


Available in the 16-SSOP (0.154, 3.90mm Width) package

ADM1030ARQZ Applications


There are a lot of Rochester Electronics, LLC ADM1030ARQZ applications of thermal management.

  • Test Equipment and Measurement Instruments
  • Notebook Computers
  • Measuring Instruments
  • Multi-processor based equipment
  • Workstations
  • Networking
  • Personal Computers (PCs) and Servers
  • Servers and Personal Computers
  • Test Equipment Instruments
  • Telecommunications

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