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ADSP-21487KSWZ-4BB

0.5mm CPLD 176 Pin 1.1V 176-LQFP Exposed Pad


  • Manufacturer: Analog Devices Inc.
  • Nocochips NO: 84-ADSP-21487KSWZ-4BB
  • Package: 176-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 637
  • Description: 0.5mm CPLD 176 Pin 1.1V 176-LQFP Exposed Pad (Kg)

Details

Tags

Parameters
Width 24mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Number of Pins 176
Packaging Tray
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) Vendor Undefined
Number of Terminations 176
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 176
Operating Temperature (Max) 70°C
Temperature Grade COMMERCIAL
Speed 400 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Clock Frequency 25MHz
Bit Size 40
Address Bus Width 24
Boundary Scan YES
Low Power Mode NO
External Data Bus Width 16
Format FLOATING POINT
Integrated Cache YES
Number of UART Channels 1
Length 24mm

ADSP-21487KSWZ-4BB Overview


It is a type of electronic component available in package 176-LQFP Exposed Pad.The packaging way is Tray.In order to mount it, it must be in the direction of Surface Mount.The use of it is terminated by 176.It is supplied with voltage by 1.1V.176 components have pins.Its configuration includes 176 pins.1 UART channels are configured for asynchronous serial communication in which the data format and transmission speeds are configurable.For its uPs/uCs/peripheral ICs, MICROPROCESSOR is used.A 25MHz-frequency clock drives it.70°C is the maximum operating temperature.

ADSP-21487KSWZ-4BB Features


Supplied in the 176-LQFP Exposed Pad package
MICROPROCESSOR as uPs/uCs/Peripheral Ics

ADSP-21487KSWZ-4BB Applications


There are a lot of Analog Devices Inc. ADSP-21487KSWZ-4BB DSP applications.

  • Medical imaging
  • Processing system
  • Seismology
  • Receivers
  • Monitoring equipment
  • Vibration signal processing
  • TVs
  • Electronic information engineering
  • Image compression
  • Instrument modeling

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