Parameters |
Mounting Type |
Surface Mount |
Package / Case |
100-LQFP |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Series |
ADSP-21xx |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
100 |
Type |
Fixed Point |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
2.5V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
100 |
JESD-30 Code |
S-PQFP-G100 |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
2.75V |
Supply Voltage-Min (Vsup) |
2.25V |
Interface |
Host Interface, Serial Port |
Clock Frequency |
33MHz |
Address Bus Width |
14 |
Boundary Scan |
NO |
Low Power Mode |
YES |
External Data Bus Width |
24 |
Voltage - I/O |
3.30V |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
External |
Voltage - Core |
2.50V |
On Chip Data RAM |
80kB |
Clock Rate |
66MHz |
Height Seated (Max) |
1.6mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
Non-RoHS Compliant |
ADSP-2185MBST-266 Overview
It is a kind of electronic component available in the 100-LQFP package.Packaging way Tray is provided.In addition to meeting a wide range of requirements, it is a member of Fixed Point.The mounting of the device is done in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~85°C in order to ensure its normal functioning.The digital voltage range of 3.30V refers to the voltage that can be input or output.This digital signal processor is part of the ADSP-21xx series.100 terminations are available for its use.The supply voltage is 2.5V.100 components have pins.A 33MHz-frequency clock drives it.
ADSP-2185MBST-266 Features
Supplied in the 100-LQFP package
ADSP-2185MBST-266 Applications
There are a lot of Rochester Electronics, LLC ADSP-2185MBST-266 DSP applications.
- Biomedical engineering
- Spectral density estimation
- Sonar
- Computer vision technology
- 3D tomography and imaging processing
- Smart phones
- Audio compression
- Image compression
- Remote sensing image processing technology
- Seismology