Parameters |
Mounting Type |
Surface Mount |
Package / Case |
144-LFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
ADSP-21xx |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
144 |
Type |
Fixed Point |
Terminal Finish |
TIN LEAD SILVER |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
2.5V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
144 |
JESD-30 Code |
S-PBGA-B144 |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
2.63V |
Supply Voltage-Min (Vsup) |
2.37V |
Interface |
Host Interface, Serial Port |
Clock Frequency |
37.5MHz |
Address Bus Width |
14 |
Boundary Scan |
NO |
Low Power Mode |
YES |
External Data Bus Width |
24 |
Voltage - I/O |
3.30V |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
External |
Voltage - Core |
2.50V |
On Chip Data RAM |
80kB |
Clock Rate |
75MHz |
Height Seated (Max) |
1.4mm |
Length |
10mm |
Width |
10mm |
RoHS Status |
Non-RoHS Compliant |
ADSP-2185MKCA-300 Overview
This is an electronic component with a 144-LFBGA package.It is provided with a packaging way of Tray.Fixed Point members are well suited for a wide range of applications.There is a mounting point for it along the direction of Surface Mount.As long as it is operated at the temperature of 0°C~70°C, it will operate normally.3.30V refers to the range of analog voltages that can be input or output.It is a part of the ADSP-21xx series of digital signal processors.In order to use it, it has 144 terminations.Using 2.5V as the supply voltage, it operates.Pins are present on the 144 component.A clock frequency of 37.5MHz is used to operate it.
ADSP-2185MKCA-300 Features
Supplied in the 144-LFBGA package
ADSP-2185MKCA-300 Applications
There are a lot of Rochester Electronics, LLC ADSP-2185MKCA-300 DSP applications.
- Machinery and equipment
- Electronic information engineering
- Monitoring equipment
- Tomography technology
- Spectral density estimation
- Encoding/broadcast
- Signal processing for telecommunications
- Vibration signal processing
- Sound navigation and ranging systems
- Infrared