Parameters |
Width |
12mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
160 |
Packaging |
Bulk |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
160 |
ECCN Code |
3A991.A.2 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Additional Feature |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
HTS Code |
8542.31.00.01 |
Subcategory |
Microprocessors |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Frequency |
600MHz |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
160 |
Power Supplies |
1.22.5/3.3V |
Temperature Grade |
COMMERCIAL |
Max Supply Voltage |
3.6V |
Min Supply Voltage |
800mV |
Memory Type |
SRAM |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Number of Bits |
16 |
Bit Size |
32 |
Frequency (Max) |
600MHz |
Data Bus Width |
16b |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FIXED POINT |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Height |
1.21mm |
Length |
12mm |
ADSP-BF533SKBCZ600 Overview
In the BGA package, it is a type of electronic component.It has a packaging style of Bulk.The use of it is terminated by 160.It works with a voltage of 1.2V as a supply voltage.The 160 component has pins.This configuration contains 160 pins.Specifically, the device is designed to operate at a frequency of 600MHz.The mounting method of the device is Surface Mount.On the basis of its specific characteristics, this device can be classified as a Microprocessors device.It is possible to supply as low a voltage as 800mV to this device.This device can be powered by 3.6V voltages.There is an electric supply from 1.22.5/3.3V.It is also possible to add additional features to ALSO REQUIRES 2.5V OR 3.3V SUPPLY with the help of this electronic component.This device uses DIGITAL SIGNAL PROCESSOR, OTHER for uPs, uCs, and peripheral ICs.Memory type SRAM is used by it.Ideally, the operating temperature should be below 70°C.The operating temperature should be in excess of 0°C.In the device, 16 information is stored.Keep its frequency below 600MHz at all times.
ADSP-BF533SKBCZ600 Features
Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics
ADSP-BF533SKBCZ600 Applications
There are a lot of Analog Devices, Inc. ADSP-BF533SKBCZ600 DSP applications.
- House construction
- 3D tomography and imaging processing
- Smart phones
- Instrument modeling
- Digital hardware
- Audio synthesis
- Digital communications
- Statistical signal processing
- Processing system
- Speech processing and recognition