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APF19-19-06CB

HEATSINK LOW-PROFILE FORGED


  • Manufacturer: CTS Thermal Management Products
  • Nocochips NO: 221-APF19-19-06CB
  • Package: -
  • Datasheet: PDF
  • Stock: 178
  • Description: HEATSINK LOW-PROFILE FORGED (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Published 2006
Series APF
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Not Included)
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 7.10°C/W @ 200 LFM
Length 0.748 19.00mm
Width 0.748 19.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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