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APR35-35-15CB/A01

Heat Sink Passive BGA Pin Array Adhesive Nylon 2.9C/W Black Anodized


  • Manufacturer: CTS Thermal Management Products
  • Nocochips NO: 221-APR35-35-15CB/A01
  • Package: -
  • Datasheet: PDF
  • Stock: 847
  • Description: Heat Sink Passive BGA Pin Array Adhesive Nylon 2.9C/W Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Series APR
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.575 14.60mm
Thermal Resistance @ Forced Air Flow 2.97°C/W @ 200 LFM
Thermal Resistance @ Natural 10.60°C/W
Length 1.366 34.70mm
Width 1.366 34.70mm
RoHS Status RoHS Compliant
See Relate Datesheet

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