Parameters | |
---|---|
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | SP1 |
Number of Pins | 1 |
Diode Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Bulk |
Published | 2007 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 12 |
Terminal Finish | TIN SILVER COPPER |
Technology | Standard |
Terminal Position | UPPER |
Terminal Form | THROUGH-HOLE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 12 |
Qualification Status | Not Qualified |
Number of Elements | 6 |
Configuration | BRIDGE, 6 ELEMENTS |
Diode Type | Three Phase |
Current - Reverse Leakage @ Vr | 20μA @ 1600V |
Voltage - Forward (Vf) (Max) @ If | 1.3V @ 70A |
Case Connection | ISOLATED |
Output Current-Max | 70A |
Current - Average Rectified (Io) | 70A |
Number of Phases | 3 |
Non-rep Pk Forward Current-Max | 600A |
Voltage - Peak Reverse (Max) | 1.6kV |
RoHS Status | RoHS Compliant |