Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount, Screw |
Mounting Type | Chassis Mount |
Package / Case | SP1 |
Number of Pins | 12 |
Diode Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Bulk |
Published | 1997 |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 12 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Technology | Standard |
Terminal Position | UPPER |
Terminal Form | THROUGH-HOLE |
Pin Count | 12 |
Number of Elements | 1 |
Element Configuration | Single |
Diode Type | Three Phase |
Current - Reverse Leakage @ Vr | 50μA @ 1600V |
Voltage - Forward (Vf) (Max) @ If | 1.3V @ 90A |
Case Connection | ISOLATED |
Forward Current | 90A |
Max Surge Current | 850A |
Forward Voltage | 1.3V |
Average Rectified Current | 90A |
Number of Phases | 3 |
Peak Reverse Current | 50μA |
Max Repetitive Reverse Voltage (Vrrm) | 1.6kV |
Peak Non-Repetitive Surge Current | 850A |
Reverse Voltage (DC) | 1.6kV |
Height | 11.5mm |
Length | 51.6mm |
Width | 40.8mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |