AS3709-BWLM-00
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 36-UFBGA, WLCSP |
| Supplier Device Package | 36-WLCSP (2.54x2.4) |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | Handheld/Mobile Devices, Solid State Drives (SSD) |
| Voltage - Supply | 2.7V~5.5V |
| Current - Supply | 110μA |
AS3709-BWLM-00 Overview
Using Tape & Reel (TR) as a shipping the power management path is acceptable.It is packaged the power management in 36-UFBGA, WLCSP for ease of transportation.Surface Mount is a universal mounting method that is easy to adapt.Among other applications, this power management targets Handheld/Mobile Devices, Solid State Drives (SSD) .A temperature setting of -40°C~85°C TA is recommended to avoid malfunctions.The power management works at 2.7V~5.5V voltage.It is recommended that the power ic receives its supply current at 110μA .
AS3709-BWLM-00 Features
Mainly used in Handheld/Mobile Devices, Solid State Drives (SSD) applications
Operating temperature: -40°C~85°C TA
AS3709-BWLM-00 Applications
There are a lot of ams AS3709-BWLM-00Power Management applications.
- Surround view system ECU
- Netbooks
- Industrial Telemetry Applications
- Computing
- Digital Cores
- Wireless routers
- WOA
- SSTL-2 WHITE SPACE
- I/Os (FPGAs, ASICs, DSPs)
- Hand-Held Systems
