Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | 8-WFDFN Exposed Pad |
Number of Pins | 8 |
Packaging | Bulk |
Published | 2012 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -65°C |
Additional Feature | LOW NOISE |
Subcategory | FET RF Small Signal |
Voltage - Rated DC | 4.5V |
Max Power Dissipation | 3W |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | 1A |
Frequency | 2GHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Configuration | SINGLE |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3W |
Case Connection | SOURCE |
Current - Test | 200mA |
Transistor Application | AMPLIFIER |
Drain to Source Voltage (Vdss) | 4.5V |
Polarity/Channel Type | N-CHANNEL |
Transistor Type | E-pHEMT |
Continuous Drain Current (ID) | 1A |
Gate to Source Voltage (Vgs) | 1V |
Gain | 14.8dB |
Drain Current-Max (Abs) (ID) | 1A |
Dual Supply Voltage | 4.5V |
DS Breakdown Voltage-Min | 7V |
Power - Output | 30dBm |
FET Technology | HIGH ELECTRON MOBILITY |
Noise Figure | 1.4dB |
Nominal Vgs | 280 mV |
Height | 800μm |
Length | 2.1mm |
Width | 2.1mm |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |