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ATS-50250B-C3-R0

HEAT SINK PASSIVE BGA SPREAD CLP


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Nocochips NO: 17-ATS-50250B-C3-R0
  • Package: BGA
  • Datasheet: -
  • Stock: 900
  • Description: HEAT SINK PASSIVE BGA SPREAD CLP (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Clip
Package / Case BGA
Material Aluminum
Shape Square, Angled Fins
Package Cooled BGA
Material Finish Blue Anodized
Series maxiGRIP, maxiFLOW
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Clip, Thermal Material
Height Off Base (Height of Fin) 0.295 7.50mm
Thermal Resistance @ Forced Air Flow 8.60°C/W @ 200 LFM
Length 0.984 25.00mm
Width 0.984 25.00mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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