ATS-54270D-C1-R0
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Adhesive |
| Material | Aluminum |
| Shape | Square, Fins |
| Package Cooled | BGA |
| Material Finish | Black Anodized |
| Published | 2008 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |
| Depth | 27mm |
| Construction | EXTRUDED |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height Off Base (Height of Fin) | 0.374 9.50mm |
| Thermal Resistance @ Forced Air Flow | 14.10°C/W @ 200 LFM |
| Device Used On | IC |
| Length | 1.063 27.00mm |
| Width | 1.063 27.00mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
