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ATS-55230W-C1-R0

Heat Sink Passive BGA Cross-Cut Adhesive 6.03C/W Black Anodized


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Nocochips NO: 17-ATS-55230W-C1-R0
  • Package: BGA
  • Datasheet: -
  • Stock: 388
  • Description: Heat Sink Passive BGA Cross-Cut Adhesive 6.03C/W Black Anodized (Kg)

Details

Tags

Parameters
Package Cooled BGA
Material Finish Black Anodized
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Depth 23mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.965 24.50mm
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 200 LFM
Length 0.900 23.00mm
Width 0.906 23.01mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week
Mount Adhesive
Package / Case BGA
Material Aluminum
Shape Square, Fins
See Relate Datesheet

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