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ATS-55330W-C1-R0

Heat Sink Passive BGA Cross-Cut Adhesive 3.4C/W Black Anodized


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Nocochips NO: 17-ATS-55330W-C1-R0
  • Package: -
  • Datasheet: -
  • Stock: 447
  • Description: Heat Sink Passive BGA Cross-Cut Adhesive 3.4C/W Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Adhesive
Material Aluminum
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Depth 33mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.965 24.50mm
Thermal Resistance @ Forced Air Flow 3.40°C/W @ 200 LFM
Length 1.299 32.99mm
Width 1.299 32.99mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
See Relate Datesheet

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