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ATS-UC-DFLOW-200

DUALFLOW HEATSINK 1U CU FINS


  • Manufacturer: Advanced Thermal Solutions Inc.
  • Nocochips NO: 17-ATS-UC-DFLOW-200
  • Package: -
  • Datasheet: PDF
  • Stock: 284
  • Description: DUALFLOW HEATSINK 1U CU FINS (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Copper
Shape Square, Fins
Package Cooled Intel LGA2011 & LGA2066 CPU Cooler
Material Finish Nickel
Series dualFLOW™
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Attachment Method Push Pin
Height Off Base (Height of Fin) 1.142 29.00mm
Length 3.637 92.38mm
Width 3.626 92.11mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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