Parameters | |
---|---|
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.3m Ω @ 195A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 7630pF @ 19V |
Current - Continuous Drain (Id) @ 25°C | 240A Tc |
Gate Charge (Qg) (Max) @ Vgs | 180nC @ 10V |
Rise Time | 200ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Vgs (Max) | ±20V |
Mount | Through Hole |
Fall Time (Typ) | 110 ns |
Mounting Type | Through Hole |
Package / Case | TO-262-3 Wide Leads |
Turn-Off Delay Time | 75 ns |
Number of Pins | 3 |
Continuous Drain Current (ID) | 240A |
Transistor Element Material | SILICON |
Threshold Voltage | 2V |
Operating Temperature | -55°C~175°C TJ |
JEDEC-95 Code | TO-262AA |
Packaging | Tube |
Gate to Source Voltage (Vgs) | 20V |
Published | 2011 |
Drain to Source Breakdown Voltage | 24V |
Series | HEXFET® |
JESD-609 Code | e3 |
Nominal Vgs | 2 V |
Height | 11.3mm |
Part Status | Active |
Length | 10.67mm |
Width | 4.83mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Radiation Hardening | No |
Number of Terminations | 3 |
REACH SVHC | No SVHC |
ECCN Code | EAR99 |
RoHS Status | ROHS3 Compliant |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Power Dissipation-Max | 300W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300W |
Turn On Delay Time | 18 ns |