Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DirectFET™ Isometric M4 |
Number of Pins | 9 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2010 |
Series | HEXFET® |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature | HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
JESD-30 Code | R-XBCC-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.5W Ta 63W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 63W |
Case Connection | DRAIN |
Turn On Delay Time | 21 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3m Ω @ 65A, 10V |
Vgs(th) (Max) @ Id | 4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 4267pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 22A Ta 108A Tc |
Gate Charge (Qg) (Max) @ Vgs | 108nC @ 10V |
Rise Time | 43ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 27 ns |
Turn-Off Delay Time | 39 ns |
Continuous Drain Current (ID) | 22A |
Threshold Voltage | 3V |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.003Ohm |
Drain to Source Breakdown Voltage | 40V |
Pulsed Drain Current-Max (IDM) | 432A |
Avalanche Energy Rating (Eas) | 286 mJ |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |