Parameters | |
---|---|
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 4 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 1W Ta |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1W |
Case Connection | DRAIN |
Turn On Delay Time | 8.1 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 75m Ω @ 2.8A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 400pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 2.8A Ta |
Gate Charge (Qg) (Max) @ Vgs | 18.3nC @ 10V |
Rise Time | 13.4ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 17.7 ns |
Turn-Off Delay Time | 22.2 ns |
Continuous Drain Current (ID) | 2.8A |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 0.0028A |
Drain-source On Resistance-Max | 0.075Ohm |
Drain to Source Breakdown Voltage | 55V |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-261-4, TO-261AA |
Number of Pins | 4 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |