Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2014 |
Series | HEXFET® |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Number of Channels | 1 |
Power Dissipation-Max | 4.2W Ta 63W Tc |
Element Configuration | Single |
Turn On Delay Time | 6.1 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 4.6m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id | 3.9V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 2170pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 84A Tc |
Gate Charge (Qg) (Max) @ Vgs | 66nC @ 10V |
Rise Time | 13ns |
Drain to Source Voltage (Vdss) | 40V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 84A |
Gate to Source Voltage (Vgs) | 20V |
Height | 1.17mm |
Length | 5.85mm |
Width | 5mm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Surface Mount |