Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Published | 2015 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Number of Elements | 1 |
Configuration | Single |
Power Dissipation-Max | 210W Tc |
Power Dissipation | 210W |
Turn On Delay Time | 15 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 185m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id | 5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 2340pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 19A Tc |
Gate Charge (Qg) (Max) @ Vgs | 57nC @ 10V |
Rise Time | 16ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 10 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 19A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 300V |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |