Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Published | 2011 |
Series | HEXFET® |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Base Part Number | IRFS8409 |
Number of Channels | 1 |
Power Dissipation-Max | 375W Tc |
Element Configuration | Single |
Power Dissipation | 375W |
Turn On Delay Time | 32 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 1.2m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id | 3.9V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 14240pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 195A Tc |
Gate Charge (Qg) (Max) @ Vgs | 450nC @ 10V |
Rise Time | 105ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 100 ns |
Turn-Off Delay Time | 160 ns |
Continuous Drain Current (ID) | 195A |
Threshold Voltage | 3.9V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 40V |
Nominal Vgs | 2.2 V |
Height | 4.83mm |
Length | 10.67mm |
Width | 9.65mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |