Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier |
Additional Feature |
AVALANCHE RATED, LOGIC LEVEL COMPATIBLE, ULTRA-LOW RESISTANCE |
Subcategory |
FET General Purpose Power |
Technology |
MOSFET (Metal Oxide) |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Qualification Status |
Not Qualified |
Number of Elements |
1 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max |
200W Tc |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.1m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
2.7V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
5080pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
160A Tc |
Gate Charge (Qg) (Max) @ Vgs |
110nC @ 5V |
Drain to Source Voltage (Vdss) |
40V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±16V |
Drain Current-Max (Abs) (ID) |
160A |
Drain-source On Resistance-Max |
0.0031Ohm |
Pulsed Drain Current-Max (IDM) |
790A |
DS Breakdown Voltage-Min |
40V |
Avalanche Energy Rating (Eas) |
490 mJ |
RoHS Status |
ROHS3 Compliant |