Parameters | |
---|---|
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
Series | HEXFET® |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Additional Feature | AVALANCHE RATED, ULTRA LOW RESISTANCE |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 35W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 35W |
Case Connection | DRAIN |
Turn On Delay Time | 8.2 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 58m Ω @ 9.6A, 10V |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 380pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 16A Tc |
Gate Charge (Qg) (Max) @ Vgs | 9.9nC @ 5V |
Rise Time | 43ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Fall Time (Typ) | 16 ns |
Turn-Off Delay Time | 19 ns |
Continuous Drain Current (ID) | 16A |
JEDEC-95 Code | TO-252AA |
Gate to Source Voltage (Vgs) | 16V |
Drain-source On Resistance-Max | 0.058Ohm |
Drain to Source Breakdown Voltage | 55V |
Pulsed Drain Current-Max (IDM) | 64A |
Avalanche Energy Rating (Eas) | 25 mJ |
RoHS Status | RoHS Compliant |