Parameters | |
---|---|
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.7m Ω @ 195A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 10315pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 195A Tc |
Gate Charge (Qg) (Max) @ Vgs | 162nC @ 4.5V |
Rise Time | 827ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Factory Lead Time | 1 Week |
Fall Time (Typ) | 355 ns |
Contact Plating | Tin |
Turn-Off Delay Time | 97 ns |
Mount | Surface Mount |
Continuous Drain Current (ID) | 195A |
Mounting Type | Surface Mount |
Gate to Source Voltage (Vgs) | 20V |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Drain to Source Breakdown Voltage | 40V |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Avalanche Energy Rating (Eas) | 255 mJ |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Height | 4.83mm |
Published | 2011 |
Series | HEXFET® |
JESD-609 Code | e3 |
Length | 10.67mm |
Part Status | Discontinued |
Width | 9.65mm |
Radiation Hardening | No |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
REACH SVHC | No SVHC |
ECCN Code | EAR99 |
RoHS Status | ROHS3 Compliant |
Additional Feature | AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 375W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 375W |
Case Connection | DRAIN |
Turn On Delay Time | 65 ns |