Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Published | 2009 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Additional Feature | ULTRA-LOW RESISTANCE |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Power Dissipation-Max | 140W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 140W |
Case Connection | DRAIN |
Turn On Delay Time | 24 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 14m Ω @ 38A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 3980pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 42A Tc |
Gate Charge (Qg) (Max) @ Vgs | 48nC @ 4.5V |
Rise Time | 110ns |
Fall Time (Typ) | 48 ns |
Turn-Off Delay Time | 33 ns |
Continuous Drain Current (ID) | 63A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 16V |
Drain Current-Max (Abs) (ID) | 42A |
Drain to Source Breakdown Voltage | 100V |
Pulsed Drain Current-Max (IDM) | 250A |
Nominal Vgs | 1 V |
Height | 2.39mm |
Length | 6.73mm |
Width | 6.22mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |