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B39242B4347P810

CSSP3 CU AE


  • Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
  • Nocochips NO: 199-B39242B4347P810
  • Package: 5-SMD, No Lead
  • Datasheet: PDF
  • Stock: 465
  • Description: CSSP3 CU AE (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 5-SMD, No Lead
Packaging Tape & Reel (TR)
Series B4347
Size / Dimension 0.055Lx0.043W 1.40mmx1.10mm
Part Status Active
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Applications Bluetooth, WLAN
Bandwidth 83.5MHz
Insertion Loss 1.8dB
Frequency - Cutoff or Center 2.442GHz
Height (Max) 0.018 0.45mm
RoHS Status ROHS3 Compliant
Ratings AEC-Q200
See Relate Datesheet

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