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B39871B4377P810

CSSP3 CU


  • Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
  • Nocochips NO: 199-B39871B4377P810
  • Package: 5-SMD, No Lead
  • Datasheet: PDF
  • Stock: 113
  • Description: CSSP3 CU (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 5-SMD, No Lead
Packaging Tape & Reel (TR)
Series B4377
Size / Dimension 0.055Lx0.043W 1.40mmx1.10mm
Part Status Active
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Applications Remote Control
Bandwidth 7MHz
Insertion Loss 2.3dB
Frequency - Cutoff or Center 866.5MHz
Height (Max) 0.018 0.45mm
RoHS Status ROHS3 Compliant
Ratings AEC-Q200
See Relate Datesheet

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