B88069X1630T602
| Parameters | |
|---|---|
| Lifecycle Status | PRODUCTION (Last Updated: 2 months ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | SMD/SMT |
| Packaging | Cut Tape |
| Tolerance | 20% |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Number of Terminations | 2 |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| Capacitance | 1.5pF |
| Terminal Position | UNSPECIFIED |
| Number of Functions | 1 |
| Depth | 8.3mm |
| Pin Count | 2 |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 10GOhm |
| Number of Poles | 2 |
| Max Voltage Rating (DC) | 90V |
| Voltage - Breakdown (Min) | 90V |
| Peak Pulse Current | 25kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Diameter | 8.3mm |
| Height | 8.3mm |
| Length | 6.05mm |
| Width | 8.3mm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
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