B88069X2331T902
| Parameters | |
|---|---|
| Lifecycle Status | PRODUCTION (Last Updated: 2 months ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | SMD/SMT |
| Packaging | Tape & Reel (TR) |
| Tolerance | 20% |
| JESD-609 Code | e3 |
| Number of Terminations | 3 |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| Terminal Position | UNSPECIFIED |
| Terminal Form | WRAP AROUND |
| Number of Functions | 1 |
| Depth | 5mm |
| Pin Count | 3 |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 1GOhm |
| Number of Poles | 3 |
| Max Voltage Rating (DC) | 90V |
| Peak Pulse Current | 10kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Diameter | 5mm |
| Length | 7.6mm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
