B88069X2670T902
| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | SMD/SMT |
| Packaging | Digi-Reel® |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Number of Terminations | 3 |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| Terminal Position | UNSPECIFIED |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Depth | 5mm |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 1GOhm |
| Number of Poles | 3 |
| Peak Pulse Current | 1kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Fail Short | No |
| Diameter | 5mm |
| Length | 7.6mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
